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quoteTitle[0]="<P class=body><SPAN class=pdf>Impacts of EU RoHS and China RoHS on IC Packaging and Their PCB Assembly Workshop<BR></SPAN></P><P class=body>In this course, some critical issues of lead-free soldering (such as cost, regulations, definitions, design, materials, forward- and backward-process incompatibility, inspections, tests, and reliability of components, PCBs, tin whiskers, and solder joints) will be presented. Also, Some critical issues of the most popular SMT packages such as PBGA, CSP, and WLCSP will be discussed. The impacts of lead-free on these SMT packages are examined.</P><P class=body><BR></P>";
quoteTitle[1]="<P class=body><SPAN class=pdf>DDR/DDR2 Tutorial<BR></SPAN></P><P class=body>This session is intended to provide both experienced and new memory device, module and system developers with additional insight into current and emerging DRAM technology solutions. The presentation material includes a broad overview and rationale for the migration of memory from asynchronous DRAM up to and including the latest DDR2 DRAM technology. A detailed analysis of the DRAM operation, timings, functions and system application conditions will also be presented, thereby enabling attendees to gain greater understanding of the key technology attributes, while assisting them in technology selection and memory performance optimization. The presenters are recognized experts in the memory industry, and are well-versed in the device design, operation, memory modules and system application considerations.</P><P class=body><BR></P>";
quoteTitle[2]="<P class=body><SPAN class=pdf>Impacts of EU RoHS and China RoHS on IC Packaging and Their PCB Assembly Workshop<BR></SPAN></P><P class=body>In this course, some critical issues of lead-free soldering (such as cost, regulations, definitions, design, materials, forward- and backward-process incompatibility, inspections, tests, and reliability of components, PCBs, tin whiskers, and solder joints) will be presented. Also, Some critical issues of the most popular SMT packages such as PBGA, CSP, and WLCSP will be discussed. The impacts of lead-free on these SMT packages are examined.</P><P class=body><BR></P>";
quoteTitle[3]="<P class=body><SPAN class=pdf>FBDIMM<BR>Unleashing Server Memory Capacity</SPAN></P><P class=body>Engineered for servers, fully buffered DIMMs (FBDIMMs) increase speed, capacity, and reliability. FBDIMM is the hottest new technology out of JEDEC.<BR><BR>Get the facts about FBDIMMs firsthand from Micron's team of experts' chief design managers who played a critical role in leading several JEDEC task groups in the standardization effort. From their unique vantage point, you will hear about all aspects of this high-performance server memory solution and find out what FBDIMMs can do for your servers.<br><br><a href='dave.htm'></a><br><br><a href='dayBlurb.js'></a></P><P class=body><BR></P>";
quoteTitle[4]="<P class=body><SPAN class=pdf>Industry Roundtable<BR>Moderator: Desi Rhoden, Inphi Corp.<BR></SPAN></P><P class=body>Come hear the leading companies discuss in open forum issues relating to:<BR><BR>- Fully Buffered DIMM (FBDIMM) - Slated for server memory expansion<BR>- DDR3 - the next memory in the DDR family<BR>- NAND vs NOR flash - industry trends in non-volatile memories<BR>- MCP - Multi Chip Packaging for the mobile world<BR><BR>Open questions from the audience.</P><P class=body><BR></P>";
quoteTitle[5]="<P class=body><SPAN class=pdf>DDR/DDR2 Tutorial<BR></SPAN></P><P class=body>This session is intended to provide both experienced and new memory device, module and system developers with additional insight into current and emerging DRAM technology solutions. The presentation material includes a broad overview and rationale for the migration of memory from asynchronous DRAM up to and including the latest DDR2 DRAM technology. A detailed analysis of the DRAM operation, timings, functions and system application conditions will also be presented, thereby enabling attendees to gain greater understanding of the key technology attributes, while assisting them in technology selection and memory performance optimization. The presenters are recognized experts in the memory industry, and are well-versed in the device design, operation, memory modules and system application considerations.</P><P class=body><BR></P>";
quoteTitle[6]="<P class=body><SPAN class=pdf>FBDIMM<BR>Unleashing Server Memory Capacity</SPAN></P><P class=body>Engineered for servers, fully buffered DIMMs (FBDIMMs) increase speed, capacity, and reliability. FBDIMM is the hottest new technology out of JEDEC.<BR><BR>Get the facts about FBDIMMs firsthand from Micron's team of experts' chief design managers who played a critical role in leading several JEDEC task groups in the standardization effort. From their unique vantage point, you will hear about all aspects of this high-performance server memory solution and find out what FBDIMMs can do for your servers.<br><br><a href='dave.htm'></a><br><br><a href='dayBlurb.js'></a></P><P class=body><BR></P>";

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